Model an electronic package with a compact thermal model
Use a compact thermal model (CTM) when you have junction-to-face thermal resistances for a package and do not want to mesh its internal construction.
Use implicit coupling
Set the coupling formulation at the top level of the request:
"ctm_coupling": "implicit"
With implicit coupling, omit relaxation_factor from each CTM because it has no effect. See Compact thermal models for how the two coupling formulations differ.
Add the package
- Add an axis-aligned package to
cuboid_components. - Set
case_sideto the face away from the board. The opposite face is used as the board side. - Make the inferred board face touch the conducting board and the complete case face touch fluid or another conducting region.
- Set
powerin W and the junction-to-board and junction-to-case resistances in K/W.
{
"tag": "processor",
"bbox": {
"origin": [0.045, 0.002, 0.04],
"size": [0.01, 0.002, 0.01]
},
"thermal_model": {
"two_resistor_ctm": {
"case_side": "y_max",
"power": 5.0,
"resistance_jb": 8.0,
"resistance_jc": 0.35
}
}
}
power must be non-negative, and both resistances must be positive.
Include heat transfer through the sides
If you have a junction-to-side resistance, use star_resistor_ctm and add resistance_js in K/W:
"thermal_model": {
"star_resistor_ctm": {
"case_side": "y_max",
"power": 5.0,
"resistance_jb": 8.0,
"resistance_jc": 0.35,
"resistance_js": 12.0
}
}
Ensure all six package faces touch the thermal domain: fluid or a conducting solid. No active face can partly touch an insulating component or the exterior of the computational domain. The same resistance_js is applied separately to each of the four side faces.
See also
- Monitor a result and stop when it settles configures junction-temperature convergence.
- Compact thermal models explains the resistor networks and coupling formulations.
- Monitors and derived quantities explains recorded junction temperatures.
- API reference lists all CTM fields.