- Overview
- 1. Tutorials
❱
- 1.1. Run your first simulation with Python
- 1.2. Design a complete electronics cooling solution
❱
- 1.2.1. Explore flow through a heated duct
- 1.2.2. Add solid components to the duct
- 1.2.3. Model a chip with a compact thermal model
- 1.2.4. Cool the chip with an annular fan
- 1.2.5. Add a CAD heatsink
- 1.2.6. Test a Raspberry Pi 5 at its maximum operating point
❱
- 1.2.6.1. STEP geometry used by the Raspberry Pi 5 cases
- 2. How-to guides
❱
- 2.1. Run simulations
❱
- 2.1.1. Set up API access
- 2.1.2. Automate a simulation with Python
- 2.1.3. Automate a simulation with a shell script
- 2.1.4. Run and compare design variants
- 2.1.5. Monitor and control a running simulation
- 2.1.6. Diagnose a rejected or failed simulation
- 2.2. Geometry and mesh
❱
- 2.2.1. Set the computational domain
- 2.2.2. Add a cuboid component
- 2.2.3. Build an assembly from cuboids
- 2.2.4. Add a CAD component
- 2.2.5. Select a boundary region
- 2.2.6. Configure the mesh
- 2.3. Flow and heat transfer
❱
- 2.3.1. Drive airflow from a fan curve
- 2.3.2. Add an internal fan with linked boundaries
- 2.3.3. Model an electronic package with a compact thermal model
- 2.4. Troubleshooting instabilities
❱
- 2.4.1. Diagnose an instability
- 2.4.2. Correct modeling problems
- 2.4.3. Switch numerics presets
- 2.4.4. Use stronger numerical relaxation
- 2.4.5. Change preconditioning
- 2.4.6. Return to first-order advection
- 2.4.7. Stabilize the energy solve
- 2.4.8. Improve mesh quality
- 2.5. Solver and results
❱
- 2.5.1. Monitor a result and stop when it settles
- 2.5.2. Inspect simulation results in ParaView
- 2.5.3. Analyze results with Python
- 2.5.4. Check a simulation result
- 3. Explanation
❱
- 3.1. What the Vanellus solver does
- 3.2. Geometry and meshing
❱
- 3.2.1. Geometry and the computational domain
- 3.2.2. Rectilinear meshing
- 3.2.3. CAD voxelization
- 3.2.4. Mesh resolution and controls
- 3.3. Boundary conditions and interfaces
❱
- 3.3.1. Boundary placement and defaults
- 3.3.2. Flow boundary conditions
- 3.3.3. Thermal boundary conditions
- 3.3.4. Fan and linked-fan boundaries
- 3.4. Flow and thermal models
❱
- 3.4.1. Material properties
- 3.4.2. Conducting and insulating domains
- 3.4.3. Turbulence inlet conditions and wall treatment
- 3.4.4. Boussinesq buoyancy and reference temperature
- 3.4.5. Compact thermal models
- 3.5. Numerics and convergence
❱
- 3.5.1. Numerics presets
- 3.5.2. Field initialization and starting guesses
- 3.5.3. Advection schemes
- 3.5.4. Relaxation
- 3.5.5. Residuals and linear-solver convergence
- 3.5.6. Preconditioners and fallbacks
- 3.6. Results and simulation lifecycle
❱
- 3.6.1. Simulation status and result files
- 3.6.2. Monitors and derived quantities
- 3.6.3. How simulations stop
- 3.6.4. VTU fields and domains